LTM8003 datasheet(2/28 Pages) AD

2 / 28 page

LTM8051

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VINn, RUNn, PGn ......................................................42V

VOUTn, BIASn ...........................................................10V

n, TRSSn, SHAREn , RTn, VCCn .............................4V

(Note 1)

SYNC23

BGA PACKAGE

91-LEAD (11.25mm

× 6.25mm × 2.22mm)

TJMAX = 125°C, θJA = 16°C/W, θJCtop = 11.4°C/W,

θJCbot = 3.5°C/W, WEIGHT = 0.42g

θ VALUES DETERMINED PER JEDEC 51-9, 51-12

VCC23

VIN4

BANK2

VOUT2

BANK3

VOUT3

BANK1

VOUT1

BANK4

VOUT4

BANK5

GND

VIN23

SHARE23

TRSS2

PG3

PG2

PG4

PG1

FB2

TRSS3 FB3

CLKOUT23 CLKOUT14

SYNC14

BIAS23

RT23

TRSS4

TRSS1

RT14

BIAS14

VCC14

SHARE14

FB1

FB4

RUN14 VIN1

RUN23

BANK6

TOP VIEW

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM8051EY#PBF

SAC305 (RoHS)

LTM8051Y

BGA

–40°C to 125°C

LTM8051IY#PBF

LTM8051IY

SnPb (63/37)

• Device temperature grade is indicated by a label on the shipping container.

• Pad or ball finish code is per IPC/JEDEC J-STD-609.

• BGA Package and Tray Drawings

• This product is not recommended for second side reflow.

This product is moisture sensitive. For more information, go to

Recommended BGA PCB Assembly and Manufacturing Procedures.

SYNC

n .......................................................................6V

Maximum Internal Temperature (Note 2) .............. 125°C

Storage Temperature ............................. –55°C to 125°C

Peak Solder Reflow Package Body Temperature ..260°C

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