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TMP139AIYAHR Fiches technique(PDF) 51 Page - Texas Instruments |
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TMP139AIYAHR Fiches technique(HTML) 51 Page - Texas Instruments |
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51 / 58 page ![]() www.ti.com PACKAGE OUTLINE C 0.4 MAX 0.17 0.11 1 TYP 0.5 TYP 6X 0.24 0.20 0.5 TYP B 0.848 0.808 A 1.348 1.308 4226160/A 08/2020 DSBGA - 0.4 mm max height YAH0006-C01 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE 0.05 C A 1 2 0.015 C A B SYMM SYMM B C SCALE 11.000 www.ti.com TMP139 SNIS217 – DECEMBER 2020 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 51 Product Folder Links: TMP139 |
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