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MAS6512 Fiches technique(PDF) 30 Page - Micro Analog systems |
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MAS6512 Fiches technique(HTML) 30 Page - Micro Analog systems |
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30 / 32 page ![]() DA6512.003 2 December, 2016 30 (32) User Direction of Feed W PO P1 D0 X X E F T B0 K0 R 0.25 typ P2 A0 SOLDERING INFORMATION For Lead-Free / Green QFN 4mm x 4mm Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260 C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin EMBOSSED TAPE SPECIFICATIONS Orientation on tape Dimension Min/Max Unit Ao 4.30 ±0.10 mm Bo 4.30 ±0.10 mm Do 1.50 +0.1/-0.0 mm E 1.75 mm F 5.50 ±0.05 mm Ko 1.10 ±0.10 mm Po 4.0 mm P1 8.0 ±0.10 mm P2 2.0 ±0.05 mm T 0.3 ±0.05 mm W 12.00 ±0.3 mm All dimensions in millimeters |
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