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LPC81xM Fiches technique(PDF) 63 Page - NXP Semiconductors |
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LPC81xM Fiches technique(HTML) 63 Page - NXP Semiconductors |
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63 / 78 page ![]() LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved. Product data sheet Rev. 4.6 — 4 April 2018 63 of 78 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 15. Package outline Fig 38. Package outline SOT097-2 (DIP8) References Outline version European projection Issue date IEC JEDEC JEITA SOT97-2 MO-001 sot097-2_po 10-10-15 10-10-18 Unit(1) mm max nom min 4.2 0.51 0.53 0.38 1.07 0.89 0.38 0.20 6.48 6.20 9.8 9.2 2.54 7.62 A Dimensions (inch dimensions are derived from the original dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-2 A1 b 1.73 1.14 b1 b2 cD(1) E(1) ee1 LME MH w 0.254 Z(1) 1.15 inches max nom min 0.17 0.02 3.43 A2 0.14 0.021 0.015 0.042 0.035 0.015 0.008 9.40 7.88 0.37 0.31 7.88 7.62 0.31 0.30 0.26 0.24 0.39 0.36 3.60 3.05 0.14 0.12 0.1 0.3 0.068 0.045 0.01 0.045 0 2.5 5 mm scale e w Z b1 D A2 A1 A L pin 1 index bb2 E 4 1 5 8 (e1) MH ME c - - - - - - |
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