ADV3003ACPZ-R7 datasheet(4/16 Pages) AD

4 / 16 page

ADV3003

Data Sheet

Rev. A | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

AVCC to AVEE

3.7 V

VTTI

AVCC + 0.6 V

VTTO

AVCC + 0.6 V

Internal Power Dissipation

2.0 W

High Speed Input Voltage

AVCC − 1.4 V < VIN <

AVCC + 0.6 V

High Speed Differential Input Voltage

2.0 V

Parallel Interface (TX_EN, PE_EN)

AVEE − 0.3 V < VIN <

AVCC + 0.6 V

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a 4-layer JEDEC circuit board for surface-mount

packages. JC is specified for the exposed pad soldered to the

circuit board with no airflow.

Table 3.

Package Type

θJA

θJC

Unit

40-Lead LFCSP

31.9

2.6

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the ADV3003

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately 150°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change

in the stresses exerted on the die by the package. Exceeding a

junction temperature of 175°C for an extended period can result

in device failure. To ensure proper operation, it is necessary to

observe the maximum power derating as determined by the

thermal resistance coefficients.

ESD CAUTION

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