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LTM8056 Fiches technique(PDF) 22 Page - Linear Technology

No de pièce LTM8056
Description  Low IQ, 60V Synchronous BoostBuck Controller
PDF  42 Pages
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Fabricant  LINER [Linear Technology]
Site Internet  http://www.linear.com
Logo LINER - Linear Technology

LTM8056 Fiches technique(HTML) 22 Page - Linear Technology

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LTC7813
22
7813f
For more information www.linear.com/LTC7813
applicaTions inForMaTion
The MOSFET power dissipations at maximum output
current are given by:
PMAIN_BUCK =
VOUT
VIN
IOUT(MAX)
(
)
2 1+δ
(
)RDS(ON) +
(VIN)2
IOUT(MAX)
2
⎟(RDR)(CMILLER) •
1
VDRVCC − VTHMIN
+
1
VTHMIN
⎥(f)
PSYNC_BUCK =
VIN − VOUT
VIN
IOUT(MAX)
(
)
2 1+δ
(
)RDS(ON)
PMAIN_BOOST =
VOUT − VIN
(
)VOUT
VIN2
IOUT(MAX)
(
)
2
1+δ
(
)RDS(ON) +
VOUT3
VIN
IOUT(MAX)
2
⎟ •
RDR
(
) CMILLER
(
)
1
VDRVCC − VTHMIN
+
1
VTHMIN
⎥(f)
PSYNC_BOOST =
VIN
VOUT
IOUT(MAX)
(
)
2 1+δ
(
)RDS(ON)
where δ is the temperature dependency of RDS(ON) and
RDR (approximately 2Ω) is the effective driver resistance
at the MOSFET’s Miller threshold voltage. VTHMIN is the
typical MOSFET minimum threshold voltage.
Both MOSFETs have I2R losses while the main N-channel
equations for the buck and boost controllers include an
additional term for transition losses, which are highest at
high input voltages for the buck and low input voltages
for the boost. For VIN < 20V (higher VIN for the boost)
the high current efficiency generally improves with larger
MOSFETs, while for VIN > 20V (lower VIN for the boost)
the transition losses rapidly increase to the point that the
use of a higher RDS(ON) device with lower CMILLER actu-
ally provides higher efficiency. The synchronous MOSFET
losses for the buck controller are greatest at high input
voltage when the top switch duty factor is low or during
a short-circuit when the synchronous switch is on close
to 100% of the period.
The term (1 + δ) is generally given for a MOSFET in the
form of a normalized RDS(ON) vs Temperature curve, but
δ = 0.005/°C can be used as an approximation for low
voltage MOSFETs.
Boost CIN, COUT Selection
The input ripple current in a boost converter is relatively
low (compared with the output ripple current), because
this current is continuous. The boost input capacitor CIN
voltage rating should comfortably exceed the maximum
inputvoltage.Althoughceramiccapacitorscanberelatively
tolerant of overvoltage conditions, aluminum electrolytic
capacitorsarenot.Besuretocharacterizetheinputvoltage
for any possible overvoltage transients that could apply
excess stress to the input capacitors.
The value of CIN is a function of the source impedance, and
in general, the higher the source impedance, the higher the
required input capacitance. The required amount of input
capacitance is also greatly affected by the duty cycle. High
output current applications that also experience high duty
cycles can place great demands on the input supply, both
in terms of DC current and ripple current.
Inaboostconverter,theoutputhasadiscontinuouscurrent,
so COUT must be capable of reducing the output voltage
ripple. The effects of ESR (equivalent series resistance)
and the bulk capacitance must be considered when choos-
ing the right capacitor for a given output ripple voltage.
The steady ripple due to charging and discharging the
bulk capacitance is given by:
Ripple =
IOUT(MAX) • VOUT − VIN(MIN)
(
)
COUT • VOUT • f
V
where COUT is the output filter capacitor.
The steady ripple due to the voltage drop across the ESR
is given by:
∆VESR = IL(MAX) • ESR
Multiple capacitors placed in parallel may be needed to
meet the ESR and RMS current handling requirements.
Dry tantalum, special polymer, aluminum electrolytic
and ceramic capacitors are all available in surface mount



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