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ADL5530ACPZ-R7 Fiches technique(PDF) 14 Page - Analog Devices |
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ADL5530ACPZ-R7 Fiches technique(HTML) 14 Page - Analog Devices |
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14 / 16 page ![]() ADL5530 Data Sheet Rev. C | Page 14 of 16 OUTLINE DIMENSIONS SEATING PLANE 0.30 0.23 0.18 0.203 REF 0.80 0.75 0.70 1.89 1.74 1.59 0.50 BSC 0.20 MIN 0.60 0.45 0.30 0.55 0.40 0.30 BOTTOM VIEW 4 1 5 8 3.25 3.00 2.75 2.25 2.00 1.75 TOP VIEW 0.05 MAX 0.02 NOM EXPOSED PAD PIN 1 INDEX AREA FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) DETAIL A (JEDEC 95) Figure 28. 8-Lead Lead Frame Chip Scale Package [LFCSP] 2 mm × 3 mm Body a nd 0.75 mm Package Height (CP-8-23) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option Branding ADL5530ACPZ-R7 −40°C to +85°C 8-Lead LFCSP, 7”Tape and Reel CP-8-23 OT ADL5530ACPZ-WP −40°C to +85°C 8-Lead LFCSP, Waffle Pack CP-8-23 OT ADL5530-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. |
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