28F032B3 datasheet(35/48 Pages) INTEL

35 / 48 page

SMART 3 ADVANCED BOOT BLOCK

PRELIMINARY

Ordering Information Valid Combinations

40-Lead TSOP

48-Ball µBGA*

CSP(1)

48-Lead TSOP

48-Ball µBGA CSP

Ext. Temp.

GT28F032B3TA95

TE28F320B3TA95

GT28F320B3TA95

32 M

GT28F032B3BA95

TE28F320B3BA95

GT28F320B3BA95

GT28F032B3TA115

TE28F320B3TA115

GT28F320B3TA115

GT28F032B3BA115

TE28F320B3BA115

GT28F320B3BA115

Ext. Temp.

TE28F016B3TA90(2)

GT28F016B3TA90(2)

TE28F160B3TA90(2)

GT28F160B3TA90(2)

16 M

TE28F016B3BA90(2)

GT28F016B3BA90(2)

TE28F160B3BA90(2)

GT28F160B3BA90(2)

TE28F016B3TA110(2)

GT28F016B3TA110(2)

TE28F160B3TA110(2)

GT28F160B3TA110(2)

TE28F016B3BA110(2)

GT28F016B3BA110(2)

TE28F160B3BA110(2)

GT28F160B3BA110(2)

Ext. Temp.

TE28F008B3TA90(2)

GT28F008B3T90

TE28F800B3TA90(2)

GT28F800B3T90

8 M

TE28F008B3BA90(2)

GT28F008B3B90

TE28F800B3BA90(2)

GT28F800B3B90

TE28F008B3TA110(2)

GT28F008B3T110

TE28F800B3TA110(2)

GT28F800B3T110

TE28F008B3BA110(2)

GT28F008B3B110

TE28F800B3BA110(2)

GT28F800B3B110

Ext. Temp

TE28F400B3T110

4 M

TE28F400B3B110

NOTES:

The 48-ball µBGA package top side mark reads F160B3 [or F800B3]. This mark is identical for both x8 and x16 products.

All product shipping boxes or trays provide the correct information regarding bus architecture. However, once the devices

are removed from the shipping media, it may be difficult to differentiate based on the top side mark. The device identifier

(accessible through the Device ID command: see Section 3.2.2 for further details) enables x8 and x16 µBGA package

product differentiation.

The second line of the 48-ball µBGA package top side mark specifies assembly codes. For samples only, the first

character signifies either “E” for engineering samples or “S” for silicon daisy chain samples. All other assembly codes

without an “E” or “S” as the first character are production units.

Product can be ordered in either 0.25 µm or 0.4 µm material. The“A” before the access speed specifies 0.25 µm material.

For new designs, Intel recommends using 0.25 µm Advanced Boot Block devices.

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