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PC755 Fiches technique(PDF) 5 Page - ATMEL Corporation

No de pièce PC755
Description  PowerPC 755/745 RISC Microprocessor
PDF  50 Pages
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Fabricant  ATMEL [ATMEL Corporation]
Site Internet  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

PC755 Fiches technique(HTML) 5 Page - ATMEL Corporation

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PC755/745
2138D–HIREL–06/03
Supports flow through (register-buffer) synchronous burst SRAMs, pipelined
(register-register) synchronous burst SRAMs (3-1-1-1 or strobeless 4-1-1-1)
and pipelined (register-register) late-write synchronous burst SRAMs
L2 configurable to direct mapped SRAM interface or split cache/direct
mapped or private memory
Core-to-L2 frequency divisors of 1, 1.5, 2, 2.5, and 3 supported
64-bit data bus
Selectable interface voltages of 2.5V and 3.3V
Parity checking on both L2 address and data
Memory Management Unit
128 entry, 2-way set associative instruction TLB
128 entry, 2-way set associative data TLB
Hardware reload for TLBs
Hardware or optional software tablewalk support
8 instruction BATs and 8 data BATs
8 SPRGs, for assistance with software tablewalks
Virtual memory support for up to 4 hexabytes (2
52) of virtual memory
Real memory support for up to 4 gigabytes (2
32) of physical memory
Bus Interface
Compatible with 60X processor interface
32-bit address bus
64-bit data bus, 32-bit mode selectable
Bus-to-core frequency multipliers of 2x, 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x,
7x, 7.5x, 8x, 10x supported
Selectable interface voltages of 2.5V and 3.3V.
Parity checking on both address and data busses
Power Management
Low-power design with thermal requirements very similar to PC740/750.
Selectable interface voltage of 1.8V/2.0V can reduce power in output buffers
(compared to 3.3V)
Three static power saving modes: doze, nap, and sleep
Dynamic power management
Testability
LSSD scan design
IEEE 1149.1 JTAG interface
Integrated Thermal Management Assist Unit
One-ship thermal sensor and control logic
Thermal
Management
Interrupt
for
software
regulation
of
junction
temperature



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