MF1ICS2005 pdf, MF1ICS2005 Description, MF1ICS2005 Fiches technique, MF1ICS2005 view ::: ALLDATASHEET :::

No de pièce	MF1ICS2005

Description	Sawn bumped 120關m wafer addendum

Taille du fichier	90.14 Kbytes

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Fabricant	NXP [NXP Semiconductors]

Site Internet	http://www.nxp.com

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Numéro de pièce similaire - MF1ICS2005

Fabricant	No de pièce	Fiches technique	Description
NXP Semiconductors	MF1ICS50	326Kb / 20P	Functional specification Public transportation Rev. 5.6-24 November 2010
	MF1ICS5005	35Kb / 7P	Standard Card IC Specification ?쐀umped sawn wafer on UV-tape? August 2004
	MF1ICS5005V1D	35Kb / 7P	Standard Card IC Specification ?쐀umped sawn wafer on UV-tape? August 2004
	MF1ICS5005W1D	35Kb / 7P	Standard Card IC Specification ?쐀umped sawn wafer on UV-tape? August 2004
	MF1ICS50	326Kb / 20P	Functional specification Public transportation Rev. 5.6-24 November 2010

Fabricant	No de pièce	Fiches technique	Description
NXP Semiconductors	MF1ICS5005	35Kb / 7P	Standard Card IC Specification ?쐀umped sawn wafer on UV-tape? August 2004
NXP Semiconductors	MF1ICS7001	293Kb / 7P	Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1-18 April 2007
Freescale Semiconductor...	MC9S08GB60	75Kb / 4P	Addendum
M/A-COM Technology Solu...	MASW-009590	227Kb / 4P	Bumped GaAs SPDT Switch
Texas Instruments	TLV5614IYZ	666Kb / 25P	12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die (Wafer Chip Scale) Package?봒b-Free/Green
M/A-COM Technology Solu...	MASW-009276-001DIE	290Kb / 5P	Bumped GaAs SP3T Switch
	MASW-009590	227Kb / 4P	Bumped GaAs SPDT Switch
	MASW-008902-000DIE	308Kb / 5P	Bumped GaAs SP3T Switch
STMicroelectronics	TN0193	117Kb / 6P	LRIS64K bumped die description 05-Jul-2010
NXP Semiconductors	SL2ICS20	44Kb / 12P	SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification December 2002