| Fabricant | No de pièce | Fiches technique | Description |
Molex Electronics Ltd. |
0015800341
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
|
|
0015800343
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits
|
|
0015800343
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800345
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits
|
|
0015800345
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800301
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
|
|
0015800301
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800303
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
0015800303
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800305
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
0015800305
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800307
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
0015800307-ND
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
0015800309
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
|
0015800309
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800321
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
|
|
0015800321
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800323
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
0015800323
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|
0015800325
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
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