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DMN1008UFDF Fiches technique(PDF) 2 Page - Diodes Incorporated

No de pièce DMN1008UFDF
Description  12V N-CHANNEL ENHANCEMENT MODE MOSFET
PDF  7 Pages
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Fabricant  DIODES [Diodes Incorporated]
Site Internet  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN1008UFDF Fiches technique(HTML) 2 Page - Diodes Incorporated

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DMN1008UFDF
Datasheet number: DS38322 Rev. 2 - 2
2 of 7
www.diodes.com
October 2017
© Diodes Incorporated
DMN1008UFDF
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
12
V
Gate-Source Voltage
VGSS
±8
V
Continuous Drain Current, VGS = 4.5V (Note 6)
Steady
State
TA = +25°C
TA = +70°C
ID
12.2
9.8
A
Pulsed Drain Current (380
μs Pulse, Duty Cycle = 1%)
IDM
60
A
Continuous Source-Drain Diode Current (Note 6)
TA = +25°C
IS
1.8
A
Avalanche Current, L = 0.1mH (Note 7)
IAS
16.4
A
Avalanche Energy, L = 0.1mH (Note 7)
EAS
13.5
mJ
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Total Power Dissipation (Note 5)
TA = +25°C
PD
0.7
W
TA = +70°C
0.4
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
RθJA
168
°C/W
Total Power Dissipation (Note 6)
TA = +25°C
PD
1.7
W
TA = +70°C
1.0
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
RθJA
74
°C/W
Thermal Resistance, Junction to Case (Note 6)
RθJC
12
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BVDSS
12
—
—
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
—
—
1
µA
VDS = 9.6V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±8V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
VGS(TH)
0.3
—
1.0
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS(ON)
—
6.6
8
m
Ω
VGS = 4.5V, ID = 5A
7.6
11
VGS = 3.0V, ID = 5A
8.5
12.5
VGS = 2.5V, ID = 5A
Diode Forward Voltage
VSD
—
0.7
1.2
V
VGS = 0V, IS = 5A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Ciss
—
995
—
pF
VDS = 6V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
—
305
—
Reverse Transfer Capacitance
Crss
—
270
—
Gate Resistance
Rg
—
1.5
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 4.5V)
Qg
—
13.6
—
nC
VDS = 6V, ID = 5A
Total Gate Charge (VGS = 8V)
Qg
—
23.4
—
Gate-Source Charge
Qgs
—
1.3
—
Gate-Drain Charge
Qgd
—
3.3
—
Turn-On Delay Time
tD(ON)
—
3.5
—
ns
VDS = 6V, VGS = 4.5V,
RG = 2Ω, ID = 5A
Turn-On Rise Time
tR
—
6.6
—
Turn-Off Delay Time
tD(OFF)
—
17.5
—
Turn-Off Fall Time
tF
—
7.5
—
Reverse Recovery Time
tRR
—
15
—
ns
IF = 5A, di/dt = 200A/μs
Reverse Recovery Charge
QRR
—
4
—
nC
IF = 5A, di/dt = 200A/μs
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.



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