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PCF26100 Fiches technique(PDF) 2 Page - NXP Semiconductors |
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PCF26100 Fiches technique(HTML) 2 Page - NXP Semiconductors |
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2 / 28 page ![]() 2001 Jun 19 2 Philips Semiconductors Preliminary specification Bluetooth Adapter IC PCF26100 CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING INFORMATION 5.1 Pinning 5.2 Pin description 6 FUNCTIONAL DESCRIPTION 6.1 PCF26100 overview 6.2 BlueRF pin mapping 6.3 Timing 6.4 Serial interface 6.5 Registers 7 REFERENCE DOCUMENTS 8 LIMITING VALUES 9 DC CHARACTERISTICS 10 AC CHARACTERISTICS 11 APPLICATIONS 12 PACKAGE OUTLINE 13 SOLDERING 13.1 Introduction to soldering surface mount packages 13.2 Reflow soldering 13.3 Wave soldering 13.4 Manual soldering 13.5 Suitability of surface mount IC packages for wave and reflow soldering methods 14 DATA SHEET STATUS 15 DEFINITIONS 16 DISCLAIMERS |
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