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UBA2033 Fiches technique(PDF) 13 Page - NXP Semiconductors |
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UBA2033 Fiches technique(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page ![]() 2002 Oct 08 13 Philips Semiconductors Product specification HF full bridge driver IC UBA2033 PACKAGE OUTLINE UNIT A1 A2 A3 bp cD(1) E(1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 1.1 0.7 8 0 o o 0.13 0.1 0.2 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. 1.03 0.63 SOT341-1 MO-150 95-02-04 99-12-27 X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 114 28 15 0.25 y pin 1 index 0 2.5 5 mm scale SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 A max. 2.0 |
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