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TPA3136D2PWPR Fiches technique(PDF) 14 Page - Texas Instruments |
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TPA3136D2PWPR Fiches technique(HTML) 14 Page - Texas Instruments |
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14 / 35 page ![]() 14 TPA3136D2, TPA3136AD2 SLOS938D – MAY 2016 – REVISED MARCH 2017 www.ti.com Product Folder Links: TPA3136D2 TPA3136AD2 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated Feature Description (continued) 9.3.9 Thermal Protection Thermal protection on the TPA3136D2/TPA3136AD2 device prevents damage to the device when the internal die temperature exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a latched fault. Thermal protection faults are reported on the FAULT pin. If automatic recovery from the thermal protection latch is desired, connect the FAULT pin directly to the SD pin. This allows the FAULT pin function to automatically drive the SD pin low which clears the thermal protection latch. |
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