 2004 Microchip Technology Inc.

DS21191M-page 19

24AA128/24LC128/24FC128

8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)

NOM

.050 BSC

INCHES

.194 BSC

.184 BSC

.226 BSC

.236 BSC

.008 REF.

D

Overall Width

JEDEC equivalent: pending

Notes:

Drawing No. C04-113

Molded Package Width

Lead Width

*Controlling Parameter

Mold Draft Angle Top

Tie Bar Width

Lead Length

R

α

B

L

D1

.014

.020

Dimension Limits

Molded Package Thickness

Pitch

Overall Height

Overall Length

Molded Package Length

Base Thickness

Standoff

Number of Pins

A3

E1

E

A2

A1

A

.000

Units

n

p

MIN

TOP VIEW

12

A2

A

5.99 BSC

.019

12

.030

.014

.016

.024

0.35

0.50

.356

0.40

0.60

5.74 BSC

12

0.47

0.75

MILLIMETERS*

.039

.002

.031

.026

.0004

.033

0.00

8

MAX

MIN

1.27 BSC

0.20 REF.

4.92 BSC

4.67 BSC

0.85

0.01

0.65

0.80

0.05

1.00

MAX

NOM

8

BOTTOM VIEW

n

E

E1

PIN 1

p

B

Exposed Pad Length

E2

Exposed Pad Width

D2

.085

.091

.097

2.16

2.31

2.46

.152

.158

.163

3.85

4.00

4.15

EXPOSED

METAL

PADS

D2

E2

A1

A3

α

L

ID

D1

D

R

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.