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Data Sheet

Direction for Circuit Board Warping

0.8mm

0.85m

m

0.8m

m

0.8m

m

CSL0901 Series

6/6

2016.03 - Rev.B

4-5. Soldering Pattern for Recommendation

We recommend the soldering pattern that shows on the right. It will be

different according to mounting situation of circuit board,　therefore,

please concern before designing.

※

The product has adopted the electrode structure that it should solder

with back electrode of the product. Thus, please be informed that the

shape of electrode pin of solder fillet formation is not guaranteed.

4-6. Reflow Profile

For reflow profile, please refer to the conditions below:(※)

・

Meaning of marks, Conditions

Mark

Meanings

Conditions

Maximum of pre-heating temperature

180ºC

Minimum of pre-heating temperature

140ºC

ts

Over 60sec.

Reference temperature

230 to 260ºC

Within 40sec.

Peak temperature

260ºC(Max)

Time for peak temperature

Within 10sec.

Δ

Temperature rising rate

Under 3ºC/sec.

Δ

Temperature decreasing rate

Over -3ºC/sec.

※

Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow

furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary

by customer’s own conditions.

4-7. Cleaning after Soldering

Please follow the conditions below if the cleaning is necessary after soldering.

Solvent

We recommend to use alcohols solvent such as, isopropyl alcohols

Temperature

Under 30ºC within 3 minutes

Ultrasonic Cleaning

15W／Below 1 liter (capacity of tank)

Drying

Under 100ºC within 3 minutes