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74LVC2G86DP Fiches technique(PDF) 11 Page - NXP Semiconductors |
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74LVC2G86DP Fiches technique(HTML) 11 Page - NXP Semiconductors |
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11 / 15 page ![]() 9397 750 14506 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 7 February 2005 11 of 15 Philips Semiconductors 74LVC2G86 Dual 2-input exclusive-OR gate Fig 9. Package outline SOT765-1 (VSSOP8) UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 ° 0 ° 0.13 0.1 0.2 0.4 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 Q 0.21 0.19 SOT765-1 MO-187 02-06-07 w M bp D Z e 0.12 14 8 5 θ A2 A1 Q Lp (A3) detail X A L HE E c v M A X A y 2.5 5 mm 0 scale VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 1 pin 1 index |
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