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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MLP2012S Fiches technique(PDF) 46 Page - Seiko Instruments Inc |
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MLP2012S Fiches technique(HTML) 46 Page - Seiko Instruments Inc |
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46 / 50 page  SII Semiconductor Corporation No. TITLE SCALE UNIT mm SNT-6A-A -Land Recommendation PG006-A-L-SD-4.1 No. PG006-A-L-SD-4.1 0.3 0.2 0.52 1.36 0.52 1 2 Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package. 2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm or less from the land pattern surface. 3. Match the mask aperture size and aperture position with the land pattern. 4. Refer to "SNT Package User's Guide" for details. 1. (0.25 mm min. / 0.30 mm typ.) 2. (1.30 mm ~ 1.40 mm) 0.03 mm SNT 1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.). 2. Do not widen the land pattern to the center of the package ( 1.30 mm ~ 1.40 mm ). 1. 2. (1.30 mm ~ 1.40 mm) (0.25 mm min. / 0.30 mm typ.) |
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