XR33152HDEVB datasheet(3/21 Pages) EXAR

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33152/XR33155/XR33156/XR33158

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REV2B

Absolute Maximum Ratings

Stresses beyond the limits listed below may cause

permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect

device reliability and lifetime.

VCC ..................................................................................-0.3V to 7.0V

VL...........................................................................VL ≤ VCC

Input voltage at control and driver input (DE, DI and INV)

XR33152/55/58.................................. -0.3V to (VCC + 0.3V)

Receiver output voltage (RO)

XR33152/55/58.................................. -0.3V to (VCC + 0.3V)

Input voltage at control (RE) XR33156

..............................................................-0.3V to (VL + 0.3V)

Input voltage at control and driver input

(DE, DI, RINV, DINV, and INV) XR33156......... -0.3V to 7.0V

Receiver output voltage (RO)

XR33156...............................................-0.3V to (VL + 0.3V)

Driver output voltage (Y, Z, A/Y and B/Z) ....................±60V

Receiver input voltage (A, B, A/Y and B/Z) .................±60V

Transient voltage pulse, through 100Ω (Figure 7) .....±100V

Driver output current...............................................±250mA

Storage temperature range ......................... -65°C to 150°C

Lead temperature (soldering 10 seconds)................. 300°C

Maximum junction temperature ................................. 150°C

Operating Conditions

Supply voltage range........................................3.0V to 5.5V

Operating temperature range ...................... -40°C to 105°C

Package power dissipation,

8-pin NSOIC

θJA .................................................128.4°C/W

Package power dissipation,

14-pin NSOIC

θJA ....................................................86°C/W

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