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MCP73861 Fiches technique(PDF) 21 Page - Microchip Technology |
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MCP73861 Fiches technique(HTML) 21 Page - Microchip Technology |
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21 / 26 page ![]() 2004 Microchip Technology Inc. DS21893A-page 21 MCP73861/2 16-Lead Plastic Quad Flat No Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated 2 1 n D E E1 D1 e b L A A1 A3 EXPOSED METAL PAD OPTIONAL INDEX AREA Contact Width *Controlling Parameter Drawing No. C04-127 Notes: JEDEC equivalent: MO-220 b .010 .012 .014 0.25 0.30 0.35 Pitch Number of Pins Overall Width Standoff Overall Length Overall Height MAX Units Dimension Limits A1 D E n e A .000 INCHES .026 BSC MIN 16 NOM MAX .002 0.00 4.00 MILLIMETERS* .039 MIN 16 0.65 BSC NOM 0.05 1.00 0.90 .035 .001 0.02 Contact Length L .012 .016 .020 0.30 0.40 0.50 E2 D2 Exposed Pad Width Exposed Pad Length .100 .106 .110 2.55 2.70 2.80 .031 0.80 3.85 4.15 .163 .157 .152 .152 .157 4.00 .163 3.85 4.15 .100 .106 2.70 .110 2.55 2.80 Revised 04-24-05 Contact Thickness A3 .008 REF 0.20 REF TOP VIEW BOTTOM VIEW |
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