IRK.166 datasheet(3/12 Pages) IRF

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IRK.166, .196, .236 Series

Bulletin I27116 rev. C 03/02

www.irf.com

Thermal and Mechanical Specifications

Max. junction operating

-40 to 150

°C

temperature range

stg

Max. storage temperature

-40 to 150

°C

range

RthJC Max. thermal resistance,

0.2

0.16

0.14

K/W

DC operation, per junction

junction to case

RthCS Max. thermal resistance,

0.05

K/W

Mounting surface smooth, flat and greased

case to heatsink

Per module

Mounting

IAP to heatsink

4 to 6

torque ± 10%

busbar to IAP

4 to 6

Approximate weight

200 (7.1)

g (oz)

Case Style

New Int-A-Pak

A mounting compound is recommended and

the

torque should be rechecked after a

period of 3 hours to allow for the spread of the

compound.Lubricatedthreads.

Parameter

IRK.166

IRK.196

IRK.236

Units Conditions

Sinusoidal conduction @ TJ max.

Rectangular conduction @ TJ max.

Devices

Units

180o

120o

90o

60o

30o

180o

120o

90o

60o

30o

IRK.166

0.025

0.03

0.038

0.055

0.089

0.018

0.031

0.041

0.057

0.089

IRK.196

0.016

0.019

0.024

0.034

0.053

0.012

0.02

0.026

0.035

0.054

K/W

IRK.236

0.009

0.010

0.014

0.018

0.025

0.008

0.012

0.015

0.019

0.025

∆R Conduction (per Junction)

(The following table shows the increment of thermal resistance R

thJC when devices operate at different conduction angles than DC)

Module Type

Circuit Configuration

Current Rating: I

F(AV)

Voltage Code: Code x 100 = V

RRM

Device Code

Ordering Information Table

IRK

236

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