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ST8034C Fiches technique(PDF) 35 Page - STMicroelectronics |
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ST8034C Fiches technique(HTML) 35 Page - STMicroelectronics |
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35 / 39 page ![]() Package information ST8034T, ST8034AT, ST8034P, ST8034C 36/40 DocID024587 Rev 4 Figure 22. Recommended footprint QFN16 - 3 x 3 x 0.8 mm, 0.5 mm pitch Table 16. QFN16 - 3 x 3 x 0.8 mm, 0.5 mm pitch package mechanical data(1), (2), (3) 1. The lead size is comprehensive of the thickness of the lead finishing material. 2. Dimensions do not include mold protrusion, not to exceed 0.15 mm. 3. Package outline exclusive of metal burr dimensions. Symbol Dimensions (mm) Note Nom. Min. Max. A 0.75 0.70 0.80 A1 0.02 0 0.05 A3 0.20 b 0.25 0.18 0.30 D 32.90 3.10 D2 1.70 1.50 1.80 E 32.90 3.10 E2 1.70 1.50 1.80 e 0.50 L 0.40 0.30 0.50 (4) 4. The value of “L” a JEDEC norm is min. 0.35 - max. 0.45. |
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