Recommendation on PCB assembly

ESDAVLC5-4BX4

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DocID023365 Rev 2

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Recommendation on PCB assembly

3.1

PCB design recommendations

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PCB pad design: Non solder mask defined

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PCB pad size: see Figure 12.

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Solder mask opening: 50 µm between the edge of the pad and the edge of the solder

mask

3.2

Stencil recommendations

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Stencil aperture: see Figure 12.

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Stencil thickness: 75 µm

Figure 12. Micro package footprint and stencil (dimensions in mm)

3.3

Solder paste recommendations

Near eutectic 95.8% Sn, 3.5% Ag, 0.7% Cu solder paste, Type 4.

Copper pad dimensions

Solder mask opening

Stencil opening