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PCF5079 Fiches technique(PDF) 21 Page - NXP Semiconductors |
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PCF5079 Fiches technique(HTML) 21 Page - NXP Semiconductors |
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21 / 28 page ![]() 2001 Nov 21 21 Philips Semiconductors Product specification Dual-band power amplifier controller for GSM, PCN and DCS PCF5079 13 PACKAGE OUTLINES UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.15 0.05 0.95 0.80 0.30 0.15 0.23 0.15 3.10 2.90 3.10 2.90 0.50 5.00 4.80 0.67 0.34 6 ° 0 ° 0.1 0.1 0.1 0.95 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.70 0.40 SOT552-1 99-07-29 w M bp D Z e 0.25 15 10 6 θ A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm SOT552-1 1.10 pin 1 index |
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