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STOD03B Fiches technique(PDF) 13 Page - STMicroelectronics

No de pièce STOD03B
Description  Step-up with LDO and inverter converters
PDF  22 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STOD03B Fiches technique(HTML) 13 Page - STMicroelectronics

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STOD03B
Application information
Doc ID 022613 Rev 1
13/22
7.1.2
Input and output capacitor selection
It is recommended to use X5R or X7R low ESR ceramic capacitors as input and output
capacitors in order to filter any disturbance present in the input line and to obtain stable
operation for the two switching converters. A minimum real capacitance value of 6 µF must
be guaranteed for CMID, CO1 and CO2 in all conditions. Considering tolerance, temperature
variation and DC polarization, 2 x 10 µF, 10 V ±10% as CMID, a 10 µF 10V ±10% capacitor
as CO1 and 2 x 10 µF 10 V ±10% as CO2 can be used to achieve the needed 6 µF.
7.2
Recommended PCB layout
The STOD03B is a high frequency power switching device and therefore requires a proper
PCB layout in order to obtain the necessary stability and optimize line/load regulation and
output voltage ripple.
Analog input (VINA) and power input (VINP) must be kept separated and connected together
at the CIN pad only. The input capacitor must be as close as possible to the IC.
In order to minimize ground noise, a common ground node for power ground and a different
one for analog ground must be used. In the recommended layout, the AGND node is placed
close to CREF ground while the PGND node is centered at CIN ground. They are connected
by a separated layer routing on the bottom through vias.
The exposed pad is connected to AGND through vias.
Figure 10.
Top layer and top silk-screen (top view, not to scale)



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