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STM32L100RB Fiches technique(PDF) 94 Page - STMicroelectronics |
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STM32L100RB Fiches technique(HTML) 94 Page - STMicroelectronics |
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94 / 103 page ![]() Package information STM32L100C6 STM32L100R8/RB 94/103 DocID024295 Rev 5 7.2 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information Figure 29. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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