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STM8S105C4 Fiches technique(PDF) 101 Page - STMicroelectronics |
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STM8S105C4 Fiches technique(HTML) 101 Page - STMicroelectronics |
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101 / 121 page ![]() DocID14771 Rev 15 101/121 STM8S105x4/6 Package information 107 11.4 UFQFPN32 package information Figure 56. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. 4. Dimensions are in millimeters. |
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