STCC5021 datasheet(34/37 Pages) STMICROELECTRONICS

No de pièce	STCC5021

Description	Constant current mode overcurrent protection

PDF	37 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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34 / 37 page

Package information

STCC5011, STCC5021

34/37

DocID024660 Rev 6

Figure 31. VFQFPN 16L - 3 x 3 x 0.8 mm with exposed pad 1.7 - recommended footprint

Table 7. VFQFPN 16L - 3 x 3 x 0.8 mm with exposed pad 1.7 - package mechanical data(1), (2), (3), (4)

Symbol

Dimensions

Notes

Data book (mm)

Nom.

Min.

Max.

0.75

0.70

0.80

0.02

0.05

0.20

0.25

0.18

0.30

2.90

3.10

1.70

1.50

1.80

2.90

3.10

1.70

1.50

1.80

0.50

0.40

0.30

0.50

(5)

1. VFQFPN - standard for “thermally enhanced very thin fine pitch quad flat package no leads”.

2. The lead size is comprehensive of the thickness of the lead finishing material.

3. Dimensions do not include mold protrusion, not to exceed 0.15 mm.

4. Package outline exclusive of metal burr dimensions.

5. The value of “L” a JEDEC norm is min. 0.35 – max. 0.45.

AM00951

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