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STCC2540 Fiches technique(PDF) 29 Page - STMicroelectronics |
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STCC2540 Fiches technique(HTML) 29 Page - STMicroelectronics |
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29 / 32 page ![]() DocID024711 Rev 6 29/32 STCC2540 Package information 32 Figure 26. VFQFPN 16L 3 x 3 x 0.8 mm with exposed pad 1.7 footprint recommended Table 6. VFQFPN 16L 3 x 3 x 0.8 mm with exposed pad 1.7 package mechanical data(1), (2), (3), (4) 1. VFQFPN - standard for “thermally enhanced very thin fine pitch quad flat package no leads”. 2. The lead size is comprehensive of the thickness of the lead finishing material. 3. Dimensions do not include mold protrusion, not to exceed 0.15 mm. 4. Package outline exclusive of metal burr dimensions. Symbol Dimensions Notes Data book (mm) Nom. Min. Max. A 0.75 0.70 0.80 A1 0.02 0 0.05 A3 0.20 b 0.25 0.18 0.30 D 3 2.90 3.10 D2 1.70 1.50 1.80 E 3 2.90 3.10 E2 1.70 1.50 1.80 e 0.50 L 0.40 0.30 0.50 (5) 5. The value of “L”, a JEDEC norm, is min. 0.35 – max. 0.45. |
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