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STTH15AC06C Fiches technique(PDF) 6 Page - STMicroelectronics |
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STTH15AC06C Fiches technique(HTML) 6 Page - STMicroelectronics |
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6 / 11 page ![]() Package information STTH15AC06C 6/11 DocID024884 Rev 1 2 Package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) • Recommended torque: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 14. TO220AB dimension definitions A F D1 J1 H1 ∅P Q D L1 L b E e1 e L20 L30 b1 c Resin gate 0.5 mm max. protrusion(1) Resin gate 0.5 mm max. protrusion(1) (1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites |
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