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STSPIN250 Fiches technique(PDF) 20 Page - STMicroelectronics |
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STSPIN250 Fiches technique(HTML) 20 Page - STMicroelectronics |
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20 / 26 page ![]() Device description STSPIN250 20/26 DocID029872 Rev 2 6.5 Thermal shutdown The device embeds circuitry protecting it from the overtemperature condition. When the thermal shutdown temperature is reached the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET. The protection and the EN\FAULT output are released when the IC temperature returns below a safe operating value (TjSD - TjSD,Hyst). Figure 11. Thermal shutdown management |
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