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Vishay Semiconductors

Rev. 1.4, 22-May-13

6

Document Number: 81778

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

REEL DIMENSIONS in millimeters

SOLDERING PROFILE

Fig. 9 - Vishay Lead (Pb)-free Reflow Soldering Profile

(acc. to J-STD-020C)

Fig. 10 - Double Wave Soldering of Opto Devices (all Packages)

21067

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s

max. ramp down 6 °C/s

19885

IR Reflow Soldering Profile for Lead (Pb)-free Soldering

Preconditioning acc. to JEDEC level 2a

max. 2 cycles allowed

255 °C

235 °C

to 260 °C

2 K/s

ca. 200 K/s

second

wave

first wave

5 s

full line: typical

dotted line: process limits

Time (s)

lead temperature

300

250

200

150

100

50

0

0

50

100

150

200

250

948626-1

TTW Soldering (acc. to CECC00802)

100 °C

to 130 °C

forced cooling

ca. 2 K/s

ca. 5 K/s