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TMP93CS42AF Fiches technique(PDF) 43 Page - Toshiba Semiconductor

No de pièce TMP93CS42AF
Description  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
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Fabricant  TOSHIBA [Toshiba Semiconductor]
Site Internet  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMP93CS42AF Fiches technique(HTML) 43 Page - Toshiba Semiconductor

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Quality and Reliability Assurance / Handling Precautions
030901
QUA-43
2002-02-20
4.5.3
Soldering Temperature Profile
The soldering temperature and heating time vary from device to device.
Therefore, when specifying the mounting conditions, refer to the individual
datasheets and databooks for the devices used.
(1)
Using a Soldering Iron
Complete soldering within ten seconds for lead temperatures of up to
260°C, or within three seconds for lead temperatures up to 350°C.
(2)
Standard Mounting Conditions for SMDs
(Surface Mount Devices)
For details, refer to section 2.1 Mounting Precautions in chapter 2
Handling Precautions for Microcontrollers.



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