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ADF4355BCPZ Fiches technique(PDF) 36 Page - Analog Devices |
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ADF4355BCPZ Fiches technique(HTML) 36 Page - Analog Devices |
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36 / 36 page ![]() Data Sheet ADF4355 Rev. A | Page 35 of 35 OUTLINE DIMENSIONS 1 0.50 BSC BOTTOM VIEW TOP VIEW PIN 1 INDICATOR 32 9 16 17 24 25 8 EXPOSED PAD PIN 1 INDICATOR SEATING PLANE 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 0.30 0.25 0.18 5.10 5.00 SQ 4.90 0.80 0.75 0.70 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.50 0.40 0.30 0.25 MIN *3.75 3.60 SQ 3.55 *COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5 WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION. Figure 47. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very, Very Thin Quad (CP-32-12) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADF4355BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12 ADF4355BCPZ-RL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12 EV-ADF4355SD1Z Evaluation Board 1 Z = RoHS Compliant Part. ©2015–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12910-0-3/16(A) |
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