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AD8233ACBZ-R7 Fiches technique(PDF) 30 Page - Analog Devices |
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AD8233ACBZ-R7 Fiches technique(HTML) 30 Page - Analog Devices |
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30 / 30 page ![]() Data Sheet AD8233 Rev. 0 | Page 29 of 29 PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS A B C D 2.080 2.040 2.000 1.745 1.705 1.665 1 2 3 4 5 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) BALL A1 IDENTIFIER 0.560 0.500 0.440 0.330 0.300 0.270 SIDE VIEW 0.230 0.200 0.170 0.300 0.260 0.220 COPLANARITY 0.04 SEATING PLANE 1.20 REF 1.60 REF 0.40 BSC 0.252 REF 0.18 REF 0.26 REF Figure 78. 20-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP] (CB-20-13) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD8233ACBZ-R7 −40°C to +85°C 20-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP] CP-20-13 AD8233CB-EBZ Evaluation Board 1 Z = RoHS Compliant Part. ©2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13737-0-8/16(0) |
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