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ADA4084-2ACPZ-R7 Fiches technique(PDF) 34 Page - Analog Devices |
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ADA4084-2ACPZ-R7 Fiches technique(HTML) 34 Page - Analog Devices |
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34 / 35 page ![]() ADA4084-1/ADA4084-2/ADA4084-4 Data Sheet Rev. H | Page 34 of 35 COMPLIANT TO JEDEC STANDARDS MO-220-WGGC. 1 0.65 BSC BOTTOM VIEW TOP VIEW 16 5 8 9 12 13 4 EXPOSED PAD PIN 1 INDICATOR 4.10 4.00 SQ 3.90 0.50 0.40 0.30 SEATING PLANE 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 PIN 1 INDICATOR 0.35 0.30 0.25 2.60 2.50 SQ 2.40 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 116. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very Very Thin Quad (CP-16-26) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 8° 0° 4.50 4.40 4.30 14 8 7 1 6.40 BSC PIN 1 5.10 5.00 4.90 0.65 BSC 0.15 0.05 0.30 0.19 1.20 MAX 1.05 1.00 0.80 0.20 0.09 0.75 0.60 0.45 COPLANARITY 0.10 SEATING PLANE Figure 117. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters |
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