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AD8290ACPZ-R21 Fiches technique(PDF) 21 Page - Analog Devices |
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AD8290ACPZ-R21 Fiches technique(HTML) 21 Page - Analog Devices |
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21 / 21 page ![]() AD8290 Rev. B | Page 20 of 20 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-248-UEED. 1 0.50 BSC PIN 1 INDICATOR TOP VIEW BOTTOM VIEW SEATING PLANE INDEX AREA 0.60 0.55 0.51 0.30 0.25 0.18 0.05 MAX 0.02 NOM 0.40 MAX 0.30 NOM 0.08 REF 3.00 BSC SQ 1.80 1.70 SQ 1.55 16 5 13 8 9 12 4 EXPOSED PAD Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP_UQ] 3 mm × 3 mm Body, Ultra Thin Quad (CP-16-12) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option Branding AD8290ACPZ-R21 −40°C to +85°C 16-Lead LFCSP_UQ CP-16-12 Y0J AD8290ACPZ-R71 −40°C to +85°C 16-Lead LFCSP_UQ CP-16-12 Y0J AD8290ACPZ-RL1 −40°C to +85°C 16-Lead LFCSP_UQ CP-16-12 Y0J 1 Z = RoHS Compliant Part. ©2007–2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06745-0-2/08(B) |
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