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AD8224BCPZ-R7 Fiches technique(PDF) 28 Page - Analog Devices |
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AD8224BCPZ-R7 Fiches technique(HTML) 28 Page - Analog Devices |
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28 / 29 page ![]() Data Sheet AD8224 Rev. D | Page 27 of 28 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-WGGC. 1 0.65 BSC BOTTOM VIEW TOP VIEW 16 5 8 9 12 13 4 EXPOSED PAD PIN 1 INDICATOR 4.10 4.00 SQ 3.90 0.50 0.40 0.30 SEATING PLANE 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 PIN 1 INDICATOR 0.35 0.30 0.25 2.60 2.50 SQ 2.40 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 68. 16-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-16-26) Dimensions are shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-263-VBBC 1 0.65 BSC 1.95 REF 0.75 0.60 0.50 TOP VIEW 12° MAX 0.80 MAX 0.65 TYP SEATING PLANE COPLANARITY 0.08 1.00 0.85 0.80 0.35 0.30 0.25 0.05 MAX 0.02 NOM 0.20 REF 16 5 13 8 9 12 4 0.60 MAX 0.60 MAX PIN 1 INDICATOR 4.10 4.00 SQ 3.90 3.75 BSC SQ BOTTOM VIEW Figure 69. 16-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.85 mm Package Height, with Hidden Paddle (CP-16-19) Dimensions shown in millimeters |
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