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THS8083APZP Fiches technique(PDF) 55 Page - Texas Instruments |
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THS8083APZP Fiches technique(HTML) 55 Page - Texas Instruments |
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55 / 64 page ![]() 7–1 7 Mechanical Data PZP (S-PQFP-G100) PowerPAD PLASTIC QUAD FLATPACK 0,13 NOM 50 26 Thermal Pad (see Note D) 0,75 0,45 0,25 Seating Plane 4146929/A 04/99 Gage Plane 0,27 75 0,17 76 100 SQ SQ 1 15,80 16,20 14,20 13,80 12,00 TYP 1,05 0,95 1,20 MAX 51 25 0,50 M 0,08 0,08 0 °–7° 0,15 0,05 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. Falls within JEDEC MS-026 PowerPAD is a trademark of Texas Instruments. |
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