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LM3526 Fiches technique(PDF) 9 Page - National Semiconductor (TI) |
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LM3526 Fiches technique(HTML) 9 Page - National Semiconductor (TI) |
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9 / 11 page ![]() Application Information (Continued) PCB LAYOUT CONSIDERATIONS In order to meet the USB requirements for voltage drop, droop and EMI, each component used in this circuit must be evaluated for its contribution to the circuit performance. The PCB layout rules and guidelines must be followed. • Place the switch as close to the USB connector as pos- sible. Keep all V bus traces as short as possible and use at least 50-mil, 1 ounce copper for all V bus traces. Solder plating the traces will reduce the trace resistance. • Avoid vias as much as possible. If vias are used, use mul- tiple vias in parallel and/or make them as large as pos- sible. • Place the output capacitor and ferrite beads as close to the USB connector as possible. • If ferrite beads are used, use wires with minimum resis- tance and large solder pads to minimize connection re- sistance. DS101097-23 FIGURE 2. Self-Powered Hub Per-Port Voltage Drop www.national.com 9 |
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