Moteur de recherche de fiches techniques de composants électroniques
  French  ▼
ALLDATASHEET.FR

X  

HMC565 Fiches technique(PDF) 7 Page - Micross Components

No de pièce HMC565
Description  Point-to-Point Radios
PDF  9 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  MICROSS [Micross Components]
Site Internet  http://www.micross.com
Logo MICROSS - Micross Components

HMC565 Fiches technique(HTML) 7 Page - Micross Components

  HMC565 Datasheet HTML 1Page - Micross Components HMC565 Datasheet HTML 2Page - Micross Components HMC565 Datasheet HTML 3Page - Micross Components HMC565 Datasheet HTML 4Page - Micross Components HMC565 Datasheet HTML 5Page - Micross Components HMC565 Datasheet HTML 6Page - Micross Components HMC565 Datasheet HTML 7Page - Micross Components HMC565 Datasheet HTML 8Page - Micross Components HMC565 Datasheet HTML 9Page - Micross Components  
Zoom Inzoom in Zoom Outzoom out
 7 / 9 page
background image
1
1 - 87
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
Absolute Maximum Ratings
Drain Bias Voltage (Vdd1, Vdd2, Vdd3)
+3.5 Vdc
RF Input Power (RFIN)(Vdd = +3.0 Vdc)
0 dBm
Channel Temperature
175 °C
Continuous Pdiss (T= 85 °C)
(derate 8.9 mW/°C above 85 °C)
0.75 W
Thermal Resistance
(channel to die bottom)
119 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
ESD Sensitivity (HBM)
Class 1A
Vdd (Vdc)
Idd (mA)
+2.5
51
+3.0
53
+3.5
55
Typical Supply Current vs. Vdd
Note: Amplifier will operate over full voltage ranges shown
above.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
v02.0209
HMC565
GaAs PHEMT MMIC LOW NOISE
AMPLIFIER, 6 - 20 GHz



Html Pages

1 2 3 4 5 6 7 8 9


Fiches technique Télécharger

Go To PDF Page


Lien URL



ALLDATASHEET vous a-t-il été utile ?  [ DONATE ] 

À propos de Alldatasheet   |   Publicité   |   Contactez-nous   |   Politique de confidentialité   |   Lien vers la fiche technique    |   Echange de liens   |   Fabricants
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com