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LSM6DS3US Fiches technique(PDF) 42 Page - STMicroelectronics |
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LSM6DS3US Fiches technique(HTML) 42 Page - STMicroelectronics |
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42 / 104 page ![]() Application hints LSM6DS3US 42/104 DocID028476 Rev 4 7.2 LSM6DS3US electrical connections in Mode 2 Figure 16. LSM6DS3US electrical connections in Mode 2 1. Leave pin electrically unconnected and soldered to PCB. The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic) should be placed as near as possible to the supply pin of the device (common design practice). The functionality of the device and the measured acceleration/angular rate data is selectable and accessible through the SPI/I2C interface. The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely programmed by the user through the SPI/I2C interface. |
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