ADPD2212ACPZ-R7 datasheet(5/14 Pages) AD

5 / 14 page

ADPD2212

Data Sheet

Rev. 0 | Page 4 of 13

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (VCC)

6.0 V

Storage Temperature Range

−40°C to +105°C

Junction Temperature

110°C

Solder Reflow Temperature (<10 sec)

260°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

Unit

3 mm × 4 mm LFCSP

66.62

11.46

°C/W

SOLDERING PROFILE

Figure 2 and Table 4 provide information about the recommended

soldering profile.

Figure 2. Recommended Soldering Profile

Table 4. Recommended Soldering Profile Limits1

Profile Feature

Condition (Pb Free)

Average Ramp Rate (T

L to TP)

2°C/sec maximum

Preheat

Minimum Temperature (T

SMIN)

150°C

Maximum Temperature (T

SMAX)

200°C

Time from T

SMIN to TSMAX (tS)

60 sec to 120 sec

Ramp-Up Rate (T

SMAX to TL)

2°C/sec maximum

Liquidus Temperature (T

217°C

Time Maintained Above T

L (tL)

60 sec to 150 sec

Peak Temperature (T

260°C + (0°C/−5°C)

Time Within 5°C of Actual T

P (tP)

20 sec to 30 sec

Ramp-Down Rate

3°C/sec maximum

Time from 25°C (t25°C) to Peak

Temperature

8 minutes maximum

1 Based on JEDEC Standard J-STD-020D.1.

ESD CAUTION

t25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

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