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TLE4955C Fiches technique(PDF) 16 Page - Infineon Technologies AG |
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TLE4955C Fiches technique(HTML) 16 Page - Infineon Technologies AG |
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16 / 21 page ![]() Data Sheet 16 Version1.0 2016-06-15 TLE4955C Confidential Package Information 9 Package Information Pure tin covering (green lead plating) is used. Lead frame material is copper based, e.g. K62. (UNS:C18090) and contains CuSn1CrNiTi. Product is RoHS (Restriction of hazardous Substances) compliant and marked with the letter G in front of the data code marking and may contain a data matrix code on the rear side of the package (see also information note 136/03). Please refer to your key account team or regional sales if you need further information. Figure 11 Pin configuration and sensitive area (view on front side with marking of component) Figure 12 Distance of the chip to the upper package edge |
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