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RN4870 Fiches technique(PDF) 21 Page - Microchip Technology

No de pièce RN4870
Description  Bluetooth 4.2 Low Energy Module
PDF  48 Pages
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Fabricant  MICROCHIP [Microchip Technology]
Site Internet  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

RN4870 Fiches technique(HTML) 21 Page - Microchip Technology

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 2016 Microchip Technology Inc.
DS50002489A-page 21
RN4870/71
FIGURE 4-13:
RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST
PCB BOARD
4.5
Soldering Recommendations
The RN4870/71 Bluetooth modules are assembled
using standard lead-free reflow profile IPC/JEDEC
J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recom-
mendations are given:
• Microchip Technology Application Note, “AN233
Solder Reflow Recommendation” (DS00233)
provides solder reflow recommendations
•Do not exceed peak temperature (TP) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
•Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
Acceptable
Best
Acceptable
Lowest
performance



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