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ACST8-8CFP Fiches technique(PDF) 2 Page - STMicroelectronics |
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ACST8-8CFP Fiches technique(HTML) 2 Page - STMicroelectronics |
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2 / 10 page ![]() ACST8 2/10 Table 2: Absolute Ratings (limiting values) Note 1: according to test described by IEC61000-4-5 standard & figure A. Table 3: Gate Characteristics (maximum values) Table 4: Thermal Resistance Table 5: Parameter Description Symbol Parameter Value Unit IT(RMS) RMS on-state current full cycle sine wave 50 to 60 Hz TO-220FPAB Tcase = 90°C 8 A TO-220AB / D2PAK Tcase = 100°C 8 ITSM Non repetitive surge peak on-state current Tj initial = 25°C, full cycle sine wave tp = 20ms 80 A tp = 16.7ms 85 A I2t Thermal constraint for fuse selection tp = 10ms 35 A2s dI/dt Non repetitive on-state current critical rate of rise IG = 10mA (tr < 100ns) Rate period > 1mn 100 A/µs VPP Non repetitive line peak pulse voltage note 1 2 kV Tstg Storage temperature range - 40 to + 150 °C Tj Operating junction temperature range - 40 to + 125 °C Tl Maximum lead soldering temperature during 10s 260 °C Symbol Parameter Value Unit PG (AV) Average gate power dissipation 0.1 W PGM Peak gate power dissipation (tp = 20µs) 10 W IGM Peak gate current (tp = 20µs) 1 A Symbol Parameter Value Unit Rth(j-a) Junction to ambient TO-220FPAB TO-220AB 60 °C/W Rth(j-a) Junction to ambien (soldered on 1 cm2 copper pad) D2PAK 45 °C/W Rth(j-c) Junction to case for full cycle sine wave conduction TO-220FPAB 3.5 °C/W Rth(j-c) Junction to case for full cycle sine wave conduction TO-220AB D2PAK 2.5 °C/W Parameter Symbol Parameter description IGT Gate triggering current VGT Gate triggering voltage VGD Non triggering voltage IH Holding current IL Latching current VTM On state voltage VT0 On state characteristic threshold voltage Rd On state characteristic dynamic resistance IDRM / IRRM Forward or reverse leakage current dV/dt Static pin OUT voltage rise (dI/dt)c Turn off current rate of decay VCL Avalanche voltage at turn off |
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