M25P16 datasheet(38/39 Pages) STMICROELECTRONICS

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M25P16

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REVISION HISTORY

Table 18. Document Revision History

Date

Rev.

Description of Revision

16-Jan-2002

0.1

Target Specification Document written

23-Apr-2002

0.4

Clarification of descriptions of entering Stand-by Power mode from Deep Power-down mode,

and of terminating an instruction sequence or data-out sequence.

ICC2(max) value changed to 10µA

13-Dec-2002

0.5

Typical Page Program time improved. Write Protect setup and hold times specified, for

applications that switch Write Protect to exit the Hardware Protection mode immediately before

a WRSR, and to enter the Hardware Protection mode again immediately after

15-May-2003

0.6

MLP8 package added

0.7

50MHz operation, and RDID instruction added. Published internally, only

20-Jun-2003

0.8

8x6 MLP8 and SO16(300 mil) packages added

24-Sep-2003

1.0

tPP, tSE and tBE revised. SO16 package code changed. Output Timing Reference Voltage

changed. Document promoted to Preliminary Data.

24-Nov-2003

2.0

Table of contents, warning about exposed paddle on MLP8, and Pb-free options added.

Value of tVSL(min) and tBE(typ) changed. Change of naming for VDFPN8 packages. Document

promoted to full Datasheet.

17-May-2004

3.0

MLP8(5x6) package removed. Soldering temperature information clarified for RoHS compliant

devices. Device Grade clarified

M25P16 Fiches technique(PDF) 38 Page - STMicroelectronics