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CAT6243DCADJ-RKG Fiches technique(PDF) 12 Page - ON Semiconductor |
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CAT6243DCADJ-RKG Fiches technique(HTML) 12 Page - ON Semiconductor |
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12 / 15 page ![]() CAT6243 www.onsemi.com 12 Figure 28. Thermal Resistance vs. PCB Copper Area for 3 mm x 3 mm WDFN Package 0 0 25 50 75 100 125 150 175 200 225 250 275 300 650 50 100 150 200 250 300 Copper heat spreading area (mm2) 1 oz C.F 2 oz C.F 1 oz Sim 2 oz Sim Figure 29. Topside Copper Foil Pattern for Heat Dissipation Close−up of pad area PCB Layout Top Layer and connections to heat spreading plane Design Hints VIN and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high due to narrow trace width or long length, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the input and output capacitors, as close as possible to the CAT6243, and keep traces between power source and load as short as possible. |
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