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INA217AIP Fiches technique(PDF) 2 Page - Texas Instruments |
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INA217AIP Fiches technique(HTML) 2 Page - Texas Instruments |
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2 / 11 page ![]() INA217 2 SBOS247A www.ti.com SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY INA217 SOL-16 DW –40 °C to +125°C INA217 INA217AIDWT Tape and Reel, 250 " """ " INA217AIDWR Tape and Reel, 1000 INA217 DIP-8 P –40 °C to +125°C INA217 INA217AIP Rails, 50 NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com. Supply Voltage, V+ to V– .................................................................. ±18V Signal Input Terminals, Voltage(2) .................. (V–) – 0.5V to (V+) + 0.5V Current(2) .................................................... 10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –55 °C to +125°C Storage Temperature ..................................................... –55 °C to +150°C Junction Temperature .................................................................... +150 °C Lead Temperature (soldering, 10s) ............................................... +300 °C NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. ABSOLUTE MAXIMUM RATINGS(1) PIN CONFIGURATIONS Top View ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NC RG 2 NC V+ NC V OUT REF NC NC RG 1 NC V IN– V IN+ NC V– NC SOL-16 NC = No Internal Connection 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 RG 2 V+ V OUT REF RG 1 V IN– V IN+ V– DIP-8 8 7 6 5 1 2 3 4 PACKAGE/ORDERING INFORMATION |
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